The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.
Scope of the Report:
This report focuses on the Molded Interconnect Devices in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The worldwide market for Molded Interconnect Devices is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx m ...
Table of Contents
1 Market Overview
1.1 Molded Interconnect Devices Introduction
1.2 Market Analysis by Type
1.2.1 Laser Direct Structuring (LDS)
1.2.2 Two-Shot Molding
1.3 Market Analysis by Applications
1.3.2 Consumer Products
1.3.5 Military & Aerospace
1.3.6 Telecommunication & Computing
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
220.127.116.11 United States Market States and Outlook (2013-2023)
18.104.22.168 Canada Market States and Outlook (2013-2023)
22.214.171.124 Mexico Market States and Outlook (2013-2023)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
126.96.36.199 Germany Market States and Outlook (2013-2023)
188.8.131.52 France Market States and Outlook (2013-2023)
184.108.40.206 UK Market States and Outlook (2013-2023)